‘Intel Is Back’: Exciting Product Roadmap Aims To Beat AMD By 2025 – Forbes

Intel (NASDAQ:INTC) has revealed an aggressive new roadmap that promises significant performance and efficiency improvements up to 2025 and beyond, with the company aiming to match and then better AMD (NASDAQ: AMD) in the processor arena.
To do this, it’s laying the groundwork for new ranges of products that will eventually include RibbonFET – the company’s first new transistor architecture for over a decade.
Apart from the new roadmap, though, which was outlined by Dr. Ann Kelleher – Senior Vice President and General Manager of Technology Development- there were two key statements made by Pat Gelsinger – Intel’s CEO – which got me really excited. Firstly, was Pat saying ‘Intel is back’. This is clearly an admission that the company hasn’t been particularly competitive or seemingly innovative recently – something most people, especially PC enthusiasts would agree with.
This admission has been a long time coming and in my view, is very much needed and is also extremely welcome. It draws a line under the various criticisms laid at Intel’s feet, especially since AMD found its feet following the launch of its Ryzen CPUs and Zen architecture back in 2017.
Intel has announced a new product roadmap
Secondly, the company aims to be back on top in terms of performance by 2025. That might seem a long time, but it has four process nodes to launch before then, starting with Alder Lake – now part of the Intel 7 node – later this year. That’s an aggressive schedule. The company has seen previous launches slip, so a renewed commitment to getting products out the door on time is definitely something I want to see as a PC enthusiasts, who is always looking for my next upgrade.
Also, it suggests we’re going to see an intense period of competition between Intel and AMD during this time, with AMD itself bringing forward new technologies such as 3D V-Cache in the near future too.
Intel has announced new technologies such as RibbonFET – its first new transistor architecture in 10 … [+] years
The new node names, which you can see below, don’t necessarily translate to the actual manufacturing process, though, but perhaps more importantly indicate when new technologies such as EUV lithography, RibbonFET and High NA EUV will be introduced.

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I’m a technology journalist with a 25 year-long interest in computer hardware, gadgets and technology. I cover the latest news and rumors about companies such as Intel,

I’m a technology journalist with a 25 year-long interest in computer hardware, gadgets and technology. I cover the latest news and rumors about companies such as Intel, AMD and Nvidia and cover major hardware launches, including my own benchmarks in the latest games and content creation software.

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